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  dmn1033ucb4 document number: ds36264 rev. 2 - 2 1 of 6 www.diodes.com september 2013 ? diodes incorporated dmn1033ucb4 new product n-channel enhancement mode field mosfet product summary v sss r ss(on) i s t a = +25c 12v 26m ? @ v gs = 4.5v 5.5 a description this new generation mosfet has been designed to minimize the on- state resistance (r ss(on) ) and yet maintain superior switching performance, making it ideal for high efficiency power management applications. applications ? battery management ? load switch ? battery protection features and benefits ? built-in g-s protection diode against esd 2kv hbm. ? totally lead-free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. ?green? device (note 3) ? qualified to aec-q101 standards for high reliability mechanical data ? case: u-wlb1818-4 ? moisture sensitivity: level 1 per j-std-020 ? terminal connections: see diagram ? weight: 0.005 grams (approximate) ordering information (note 4) part number case packaging dmn1033ucb4-7 u-wlb1818-4 3000/tape & reel notes: 1. no purposely added lead. fully eu directiv e 2002/95/ec (rohs) & 2011/6 5/eu (rohs 2) compliant. 2. see http://www.diodes.com/quality/lead_free.html for more in formation about diodes incorporated?s definitions of halogen- a nd antimony-free, "green" and lead-free. 3. halogen- and antimony-free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total br + cl) and <1000ppm antimony compounds. 4. for packaging details, go to our website at http://www.d iodes.com/products/packages.html. marking information date code key year 2009 2010 2011 2012 2013 2014 2015 code w x y z a b c month jan feb mar apr may jun jul aug sep oct nov dec code 1 2 3 4 5 6 7 8 9 o n d top view equivalent circuit gw = product type marking code ym = date code marking y = year (ex: y = 2011) m = month (ex: 9 = september) s1 g1 s2 g2 esd protected to 2kv
dmn1033ucb4 document number: ds36264 rev. 2 - 2 2 of 6 www.diodes.com september 2013 ? diodes incorporated dmn1033ucb4 new product maximum ratings characteristic symbol value units drain-source voltage v sss 12 v gate-source voltage v gss ? 6 v continuous source current @ v gs = 4.5v t a = +25c (note 5) steady state t a = +25c t a = +70c i s 5.5 4.5 a pulsed source current @ t a = +25c (notes 5 & 6) i sm 20 a thermal characteristics characteristic symbol value units power dissipation, @t a = +25c (note 5) p d 1.45 w thermal resistance, junction to ambient @t a = +25c (note 5) r ? ja 88.21 c/w operating and storage temperature range t j , t stg -55 to +150 c electrical characteristics (@t a = +25c, unless otherwise specified.) characteristic symbol min typ max unit test condition off characteristics (note 7) source to source breakdown voltage t j = +25c v (br)ss 12 ? ? v i s = 1ma, v gs = ? v zero gate voltage source current t j = +25c i sss ? ? 1.0 a v ss = 12v, v gs = 0v gate-body leakage i gss ? ? ? 10 a v gs = ? 6v, v ds = 0v on characteristics (note 7) gate threshold voltage v gs(th) 0.35 0.5 0.7 v v ss = 10v, i s = 1.0ma static source -source on-resistance r ss(on) ? 19.5 20 20.5 21 21.5 22 26 35 26 27 28 29 30 31 33 50 m ? v gs = 4.5v, i s = 3.0a v gs = 4.0v, i s = 3.0a v gs = 3.7v, i s = 3.0a v gs = 3.5v, i s = 3.0a v gs = 3.1v, i s = 3.0a v gs = 2.5v, i s = 3.0a v gs = 1.8v, i s = 3.0a v gs = 1.5v, i s = 3.0a forward transfer admittance |y fs | ? 11 ? s v ss = 10v, i s = 3.0a body diode forward voltage v f(s-s) ? 0.7 1.0 v i f = 3.0 a, v gs = 0 v, dynamic characteristics (note 8) total gate charge q g ? 37 ? nc v gs = 4.5v, v ss = 10v, i s = 6a turn-on delay time t d(on) ? 10 ? ns v dd = 6v, r l = 6.0 ? , i s = 3.0a turn-on rise time t r ? 20 ? ns turn-off delay time t d(off) ? 83 ? ns turn-off fall time t f ? 52 ? ns notes: 5. device mounted on fr4 material with 1-inch 2 (6.45-cm 2 ), 2-oz. (0.071-mm thick) cu. 6. repetitive rating, pulse width limited by junction temperature. 7. short duration pulse test used to minimize self-heating effect. 8. guaranteed by design. not subject to production testing.
dmn1033ucb4 document number: ds36264 rev. 2 - 2 3 of 6 www.diodes.com september 2013 ? diodes incorporated dmn1033ucb4 new product v , drain-source voltage (v) figure 1 typical output characteristics ds i, d r ain c u r r en t (a) d 0.0 2.0 4.0 6.0 8.0 10.0 12.0 0 0.5 1 1.5 2 2.5 3 v= 1.0v gs v= 0.9v gs v= 4.0v gs v= 4.5v gs v= 6.0v gs v= 1.2v gs v= 1.5v gs v= 2.0v gs v , gate-source voltage (v) gs figure 2 typical transfer characteristics i, d r ain c u r r ent (a) d 0 4 8 12 16 20 0 0.3 0.6 0.9 1.2 1.5 v = 5.0v ds t = 150c a t = 125c a t = 85c a t = 25c a t = -55c a i , drain-source current (a) d figure 3 typical on-resistance vs. drain current and gate voltage r , d r ai n -s o u r c e o n - r esis t a n c e ( ) ds(on) ? 0 0.01 0.02 0.03 0.04 0.05 0.06 024681012 v = 1.8v gs v = 4.5v gs v = 1.5v gs v = 6.0v gs i , drain current (a) d figure 4 typical on-resistance vs. drain current and temperature r , d r ai n -s o u r c e o n - r esista n c e ( ) ds(on) ? 0.01 0.015 0.02 0.025 0.03 0.035 024681012 t = -55c a t = 25c a t = 85c a t = 125c a t = 150c a v = 4.5v gs 0.6 0.8 1.0 1.2 1.4 1.6 -50 -25 0 25 50 75 100 125 150 t , junction temperature ( c) figure 5 on-resistance variation with temperature j ? r , d r ain-s o u r c e on-resistance (normalized) ds(on) v= v i= 4.0a gs d 1.8 -50 -25 0 25 50 75 100 125 150 t , junction temperature ( c) figure 6 on-resistance variation with temperature j ? r , d r ain-s o u r c e o n- r esis t an c e ( ) ds(on) ? 0.01 0.015 0.02 0.025 0.03 0.035 0.04 0.045 0.05 v= v i = 4.0a gs d 1.8
dmn1033ucb4 document number: ds36264 rev. 2 - 2 4 of 6 www.diodes.com september 2013 ? diodes incorporated dmn1033ucb4 new product -50 -25 0 25 50 75 100 125 150 t , junction temperature ( c) figure 7 gate threshold variation vs. ambient temperature j ? v, g ate t h r es h o ld v o lta g e (v) gs(th) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 i= 1ma d i= 250a d v , source-drain voltage (v) sd figure 8 diode forward voltage vs. current i, s o u r c e c u r r en t (a) s 0 2 4 6 8 10 12 0 0.2 0.4 0.6 0.8 1 t = 25c a 1.2 1.4 v , drain-source voltage (v) ds figure 9 typical junction capacitance c , j u n c t i o n c a p a c i t a n c e (pf) t f = 1mhz 100 1000 10000 0 2 4 6 8 10 12 c iss c oss c rss v , gate-source voltage (v) gs figure 10 gate-source leakage current vs. voltage i , leaka g e c u r r en t (na) gss 0.1 1 10 100 1000 10000 12 3 4 56 t = -55c a t = 85c a t = 125c a t = 150c a t = 25c a v , drain-source voltage (v) figure 11 soa, safe operation area ds 0.01 0.1 1 10 100 i, d r ain c u r r en t (a) d r limited ds(on) t = 150c t = 25c single pulse dut on 1 * mrp board v = 6v j(max) gs a 0.01 0.1 1 10 100 dc p = 10s w p = 1s w p = 100ms w p = 10ms w p = 1ms w p = 100s w p = 100s w
dmn1033ucb4 document number: ds36264 rev. 2 - 2 5 of 6 www.diodes.com september 2013 ? diodes incorporated dmn1033ucb4 new product package outline dimensions please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. suggested pad layout please see ap02001 at http://www.diodes.com/dat asheets/ap02001.pdf for the latest version. 0.0001 0.001 0.01 0.1 1 10 100 1,000 t1, pulse duration time (sec) figure 12 transient thermal resistance 0.001 0.01 0.1 1 r(t), t r ansien t t h e r mal r esis t an c e d = 0.5 d = 0.7 d = 0.9 d = 0.3 d = 0.1 d = 0.05 d = 0.02 d = 0.01 d = 0.005 d = single pulse r (t) = r(t) * r r = 156c/w duty cycle, d = t1/ t2 ?? ? ja ja ja u-wlb1818-4 dim min max typ a ? 0.62 ? a2 ? ? 0.36 b 0.25 0.35 0.30 d 1.75 1.80 1.79 e 1.75 1.80 1.79 e ? ? 0.65 all dimensions in mm dimensions value (in mm) c 0.65 d 0.30 d 4 x c a b 2 1 c a 2 a s e a t i n g p l a n e e e a b 2 1 6 x - ? b a b 2 1 d e p i n i d
dmn1033ucb4 document number: ds36264 rev. 2 - 2 6 of 6 www.diodes.com september 2013 ? diodes incorporated dmn1033ucb4 new product important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. diodes incorporated does not assume any liability ari sing out of the application or use of this document or any product described herein; neither does diodes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or user of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability w hatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of t his document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical com ponents in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2013, diodes incorporated www.diodes.com


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